Blow the tables will help you find the material that best suits your application needs. The interface materials selection guide and comparison tables:

As electronics increasingly advances, so too must the technology involved in manufacturing thermal interfaces. Increasing demands for better thermal dissipation and heat transfer resulted in the development by AOK of Boron Nitride loaded elastomers, these proved significantly more efficient than the standard Al₂O₃ variety. By varying the density of the particles suspended in the silicone, the key properties of these materials can be adjusted, by increasing the loading the thermal performance can be increased, but to the detriment of the voltage isolation. However there is enough latitude within this balance to provide a comprehensive range of basic thermal pads.

An undesirable consequence of increased particle loading is that the silicone elastomer becomes harder and more friable. This suggests an upper limit at which this combination of materials is so hard and delicate that it becomes practically unusable in anything other than prototype of small scale production. Before this point is reached Warth has placed a very high performance product, TP300 series. It offers thermal conductivity of 3.0 W/m.K, and remains soft enough and malleable enough to be used in all typical applications, large and small.

Aochuan Technology Disclaimer:

Performance data is provided as a reference to compare material thermal performance. the reduced volume of thermal particles means a softer overall elastomer, so better heat transfer efficiency and, more importantly, lower cost. For more information on the full range of AOK™ products available from China please call 0755 2976 5771 or email sales@aok-technology.com  

Downloads:

PCB Thermal Considerations PDF
Heat Transfer Silicone Pad
AOK Brand Heatsink Thermal Pad
Material Producer AOK Presentation PDF