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How to transfer or dissipate the heat from the heat-generating components to heat sinks?

The key component in the heat exchange is the interfacial joint along with air gaps between the heat sinks and electronic devices where uneven or rough textures are existing.

Air is a very poor thermal conductor and restricts the flow of heat from the heat generating component to the heat sinks. In order to get the best performance of the heat sink, as well as to keep the operating temperature of the component to a minimum, the air gaps must be filled with Thermal Interface Materials(TIMs),which are the most compressible and highly conformable thermal gap fillers. As a result of its compressibility and ability to accommodate loose flatness tolerances, AOK TIMs minimize the extreme stresses to components and eliminate the air gaps to reduce the thermal resistance, as well as high conformability reduces interfacial resistance!

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Any information contained herein is believed to be accurate and reliable. AOK and its agents does not assume any responsibility or liability for any advice furnished by it, or for the performance or results of any installation or use of the product(s) or of any final products into which the product(s) may be incorporated by the purchaser and/or user. The purchaser and/or user should perform its own tests to determine the suitability and fitness of the product (s) for the particular purpose desired in any given situation.

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