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Thermally Conductive Gap Filler

TP 300 Series Thermally Conductive Gap Filler

Features:

-High thermal conductivity
-High conformability and cost effective
-Naturally tacky requiring no additional adhesive coating
-Electrically insulating

TP 300 Series Thermally Conductive Gap Filler

Applications:

- Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
- Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
- Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.

Properties of TP300
Properties	Units	TP300	Test Method
Construction & Composition	---	Silicone & Ceramic filled	---
Color	---	Light Blue	Visual
Thickness Range	mm	0.5~5.0	---
Hardness	Shore C	25	ASTM D2240
Density	g/cc	2.7	ASTM D792
Tensile Strength	KN/m	0.3	ASTM D412
Elongation	%	64%	ASTM D412
Continuous Use Temp	℃	-40 to 150	EN344
Breakdown Voltage	Kv/mm	≥5.0	ASTM D149
Volume Impedance	ohm-cm	1.1*10¹⁶	ASTM D257
Dielectric Constant	1MHz	7.15	ASTM D150
Weight Daminify	---	≤0.3﹪	@150℃ 240H
Flame Rating	---	V-0	UL 94
Thermal Conductivity	W/m.k	3.0	ASTM D5470
UL, RoHS, REACH	---	Compliance	---

Sheet sizes:

Standard sheet size:200*400mm；Custom Die-cut parts available；Available with or without PSA on reinforced side

REACH Compliant RoHS Compliant

TP 300 Series Thermal Gap Filler is naturally tacky, requiring no adhesive coating to inhabit thermal performance, It can also be with a rubber-coated fiberglass carrier becoming one side tacky and no tacky on other side to allowing easy material handing and installation.

Downloads:
PDF TP300 Specification Sheet

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REACH Compliant RoHS Compliant