ANK Thermal Gap Filler Pads

Use this part number system when ordering ANK Thermal Gap Filler like blow

Efficient thermal transfer depends directly on the ability of thermal interface materials

Poor thermal management leads to more than 50% of electronic failures. The failure rate for electronics increases exponentially with the increase in junction temperature.  Specifically, the failure rate of an electronic device doubles with every 10°C increase in chip junction temperature. The ability to transfer and dissipate heat generated at the chip level directly affects the system's reliability.

Efficient thermal transfer depends directly on the ability of thermal interface materials to fill in all interfacial voids and avoid creating internal voids of their own. Thermal interface materials must also have outstanding thermal conductivity. All of ANK thermal interface materials of thermal gap filler pads, thermal adhesives, thermal greases, thermal gels and compressible phase-change thermal pads are engineered and manufactured to satisfy these criteria. ANK's thermal interface materials products are designed to both optimize heat transfer and improve the reliability of electronic devices during thermal cycling.