-Lowest thermal resistance
-High conformability and cost effective
-Long reliability
-Designed for easy application
Applications:
- Between CPU,high performance GPU,IGBT and heatsink
- Telecom device, Military,Motol control Led lighting etc
- Cooling Module, memory module, in all applications where lower thermal resistance is required
Typical Properties of TG500 Series
Properties
Units
TG500
Test Method
Color
---
Gray / pasty
Visual
Density
g/ml
2.85±0.1
ASTM D374
Continuous Use Temp
℃
-60 to 200
EN344
Breakdown Voltage
Kv/mm
5
ASTM D149
Volume Impedance
ohm-cm
1.7*1016
ASTM D257
Dielectric Constant
1KHz
0.4
ASTM D150
Flame Rating
---
V0
UL 94
Thermal Conductivity
W/m.k
4.5
ASTM D5470
Thermal Resistance @50psi
℃-in2/W
0.06
ASTM D5470
RoHS
---
Compliance
---
REACH
---
Pending
---
Standard Container:
1 KG / Container; 2KG / Container; Special spec. available
Aochuan Technology offers many other thermal interface materials that may not be shown on our web site. Please go to Contact Form to receive a recommendation from our office on your specific application.