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>> Your are Here: Home >> Products center >> Thermally Conductive Gap Filler
Thermally Conductive Gap Filler
TP 120 Series Thermally Conductive Gap Filler
Features:

-Good thermal conductivity
-Extremely soft and cost effective
-Naturally tacky
-Electrically insulating
TP 120 Series Thermally Conductive Gap Filler
Applications:

- Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
- Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
- Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.

TP120 Series Compressure Deflection

 

Typical Properties of TP120
Properties Units TP120 Test Method
Construction & Composition --- Silicone & Ceramic filled ---
Color --- Pink Visual
Thickness Range mm 1.0~12.0 ---
Hardness Shore C 15 ASTM D2240
Density g/cc 2.3 ASTM D792
Tensile Strength KN/m 1 ASTM D412
Elongation % 70% ASTM D412
Continuous Use Temp ℃ -40 to 150 EN344
Breakdown Voltage Kv/mm ≥6.5 ASTM D149
Volume Impedance ohm-cm 3.5*1012 ASTM D257
Dielectric Constant 1MHz 3.87 ASTM D150
Weight Daminify --- ≤1﹪ @150℃ 240H
Flame Rating --- V-0 UL 94
Thermal Conductivity W/m.k 1.2 ASTM D5470
UL, RoHS, REACH --- Compliance ---
Sheet sizes:
Standard sheet size:200*400mm；Custom Die-cut parts available；Available with or without PSA on reinforced side

REACH Compliant RoHS Compliant

 

TP 120 Series Thermal Gap Filler is naturally tacky, requiring no adhesive coating to inhabit thermal performance, It can also be with a rubber-coated fiberglass carrier becoming one side tacky and no tacky on other side to allowing easy material handing and installation.

Downloads:
PDF TP120 Specification Sheet
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