Thermal Pad Features - HIGH PERFORMANCE AOK^TM THERMAL INTERFACE MATERIALS

Soft with high compressibility to reduce thermal resistance and enhance thermal conductivity Optional thermal conductivities for your cooling applications. Naturally sticky Cost effective solutions with competitive price. Thermally conductive silicone rubber heat transfer pads and gaskets from gap filling compounds.

AOK Brand thermal pads are ideal for height differences and unevenness in heat sinks and to bring the elements to be cooled. Given their high elastic and low hardness is achieved already by a low pressure is a very good fit to the surface. There are balanced all the large and small differences in elevation, even of microscopic grooves to visible imperfections.

Thermal Pad Applications

- Between electronic components such as semiconductor, IC, CPU.MOS and heatsink.
- Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
- Cooling Module, Thermal Module, in all applications where a metal housing is used as heatsink.

Aochuan Technology Disclaimer:

The surface of the pad is slightly sticky and covered with a protective film. These must be removed before installation. Now comes the slight stickiness on the effect and slipping when mounting a heat sink is thus excluded. These thermal pads can of course be cut to the desired size. As a basic component or spare part in any thermal pads are well-organized computer Craft Corner!

Any information contained herein is believed to be accurate and reliable. AOK^TM Corporation and its agents does not assume any responsibility or liability for any advice furnished by it, or for the performance or results of any installation or use of the product(s) or of any final products into which the product(s) may be incorporated by the purchaser and/or user. The purchaser and/or user should perform its own tests to determine the suitability and fitness of the product (s) for the particular purpose desired in any given situation.