ANK Thermal Interface Materials(TIMs)

All thermally conductive Gap Filler family products are thermal interface materials, which are used to fill in air gaps between heat-generating electronic device and heatsinks or metal housing or chassis for intimate contact over rough or uneven surface textures to eliminate air gaps and reduce thermal resistance with high conformability.

The thermal interface materials act on thermal conduction

Consider no thermal interface material fills in between heat-generating component and heat sink, where air flows through these two interfaces, as illustrated in (A). High air thermal resistance will cause the undesirable effects in heat dissipation.

Consider well thermal interface materials fill in between heat source and heat sink or chassis, where air flows through these two interfaces, as illustrated in (B). Thermal interface materials are used to fill gaps which already exist in the air. Due to the heat transfer efficiency of thermal interface materials is more than decuple than the air, which means: They enhance integral heat transfer efficiency provide excellent thermal management solutions as well.

The Thermal Interface Materials Products:

Thermal Grease/Compounds(TIMs)
Our Thermal Greases provide high thermal conductivities, minimum bondline thicknesses and superior surface wetting. They don’t dry out or pump-out and remain stable through all standard reliability testing.

Thermal Pads (TIMs)
Soft with high compressibility to reduce thermal resistance and enhance thermal conductivity Optional thermal conductivities for your cooling applications Naturally sticky Cost effective solutions with competitive price

Phase-Change Interface Material(PCM)
Phase-change interface materials are characterized by the material's change from solid to soft aggregate state at a pre-defined temperature - the so-called phase-change temperature.

Thermally Conductive Insulator(TIMs)
High-power thermal insulator pads are thermally interface materials designed for use where the highest possible thermal, dielectric, and mechanical properties are required.

Thermal Tape(TIMs)
ANK thermally conductive tape are formulated with acrylic or silicone based pressure sensitive adhesive (PSA) loaded with thermally conductive fillers. They are designed to securely bond heat sinks to power dissipating components without an additional clamping mechanism.