Features:
|
-Thermal conductivity: 1.2 W/m.k
-High conformability and cost effective
-Double-sided, pressure sensitive adhesive tape
-Electrically insulating
|
|
|
Applications:
|
- Between electronic components such as Semiconductor,IC, MOS and heatsink.
- Mount heat sink/spreader onto drive process/power converter
- In all applications where a metal housing is used as heatsink without screw.
|
|