Shenzhen Aochuan Technology Co., Ltd established in 2004, is a world leading Chinese developer and manufacturer of thermal interface materials products. Using thermal interface materials to improve Heat Sink thermal performance.

Thermal management solutions

The general 3C electronic products will have a thermal management problem. Today’s electronics are smaller and more powerful than ever, leading to ever increasing thermal challenges for the systems designer. While fans, heat sinks, and even liquid cooling and thermoelectric devices can be used to provide enough cooling power, the problem remains to get the heat from the hot components into the cooling hardware. Thermal Interface Materials (TIMs) are designed to fill in air gaps and microscopic irregularities, resulting in dramatically lower thermal resistance and thus better cooling.

Thermal pads provided by AOK are used in a variety of electronic applications and industries including computers, laptops, tablet PCs, smart phones, routers, LEDs, solar, medical device, power supplies, wireless devices, and the automotive industry.

AOK™ Thermal Management Interface Materials

Proven, high performance solutions for cooling high intensity LEDs, bonding heat sinks, heat spreaders and other cooling devices to IC packages and power transistors. A variety of specific?compounds are available for a wide range of performance requirements in Sheets, Rolls, Die-cuts, Sleeves, Gel, Extrusions, Moldings.

AOK™ All Types of Thermal Materials Application Guidelines and Thermal Conductivity

Our customers in many countries, they can rely on our product quality and superb customer service. We offer not only a technical team available to develope new electronics cooling thermal interface materials, but we also employ expert engineers offer support online.