-High thermal conductivity of 3.0 w/(m·k)
-High conformability and cost effective
-Long reliability; Lowest thermal resistance
-Designed for easy application

It is usually used as the thermal conductive medium in electronic components to reduce the heat resistant of the contact surface, consequently reduce the temperature of the electric component.

TG300 Series is a thermally conductive grease compound designed for:

- Between CPU,high performance GPU,IGBT and heatsink
- Telecom device, Military,Motol control Led lighting etc
- Cooling Module, memory module, in all applications where lower thermal resistance is required

1 KG / Container; 2KG / Container; Special spec. available

Aochuan Technology offers many other thermal interface materials that may not be shown on our web site. Please go to Contact Form to receive a recommendation from our office on your specific application.